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| author | Like Xu <like.xu@linux.intel.com> | 2019-06-20 13:45:23 +0800 |
|---|---|---|
| committer | Eduardo Habkost <ehabkost@redhat.com> | 2019-07-05 17:08:04 -0300 |
| commit | a94e1428991f741e2c6636e7c8df7f8d1905d983 (patch) | |
| tree | f09158d8e90fc8ee9c5dcf9aad90902fc57e6fa4 /include/hw/boards.h | |
| parent | 1c809535e3083d4299899e9843a3f4e44b191a9c (diff) | |
| download | focaccia-qemu-a94e1428991f741e2c6636e7c8df7f8d1905d983.tar.gz focaccia-qemu-a94e1428991f741e2c6636e7c8df7f8d1905d983.zip | |
target/i386: Add CPUID.1F generation support for multi-dies PCMachine
The CPUID.1F as Intel V2 Extended Topology Enumeration Leaf would be exposed if guests want to emulate multiple software-visible die within each package. Per Intel's SDM, the 0x1f is a superset of 0xb, thus they can be generated by almost same code as 0xb except die_offset setting. If the number of dies per package is greater than 1, the cpuid_min_level would be adjusted to 0x1f regardless of whether the host supports CPUID.1F. Likewise, the CPUID.1F wouldn't be exposed if env->nr_dies < 2. Suggested-by: Eduardo Habkost <ehabkost@redhat.com> Signed-off-by: Like Xu <like.xu@linux.intel.com> Message-Id: <20190620054525.37188-2-like.xu@linux.intel.com> Signed-off-by: Eduardo Habkost <ehabkost@redhat.com>
Diffstat (limited to 'include/hw/boards.h')
0 files changed, 0 insertions, 0 deletions